Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825756 | Chip attached to a die pad having a concave structure | Yoshiharu Takada | 2020-11-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825756 | Chip attached to a die pad having a concave structure | Yoshiharu Takada | 2020-11-03 |