Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10865332 | Epoxy resin composition and electronic component device | Hirokuni Ogihara, Shinya Nakamura, Takatoshi Ikeuchi, Takashi Yamamoto | 2020-12-15 |
| 10662315 | Epoxy resin molding material for sealing and electronic component device | Mitsuyoshi Hamada, Ryoichi Ikezawa, Keizo Takemiya, Toru Baba | 2020-05-26 |