Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10662315 | Epoxy resin molding material for sealing and electronic component device | Fumio Furusawa, Ryoichi Ikezawa, Keizo Takemiya, Toru Baba | 2020-05-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10662315 | Epoxy resin molding material for sealing and electronic component device | Fumio Furusawa, Ryoichi Ikezawa, Keizo Takemiya, Toru Baba | 2020-05-26 |