Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790192 | Wafer processing method | Hidekazu Iida, Susumu Yokoo, Hiroyuki Takahashi, Kenta Chito | 2020-09-29 |
| 10790193 | Wafer processing method | Hidekazu Iida, Susumu Yokoo, Hiroyuki Takahashi, Kenta Chito | 2020-09-29 |