Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790192 | Wafer processing method | Yoshiteru Nishida, Hidekazu Iida, Susumu Yokoo, Hiroyuki Takahashi | 2020-09-29 |
| 10790193 | Wafer processing method | Yoshiteru Nishida, Hidekazu Iida, Susumu Yokoo, Hiroyuki Takahashi | 2020-09-29 |
| 10665492 | Wafer unloading method | — | 2020-05-26 |