HI

Hidekazu Iida

DI Disco: 2 patents #22 of 148Top 15%
Overall (2020): #168,521 of 565,922Top 30%
2
Patents 2020

Issued Patents 2020

Patent #TitleCo-InventorsDate
10790192 Wafer processing method Yoshiteru Nishida, Susumu Yokoo, Hiroyuki Takahashi, Kenta Chito 2020-09-29
10790193 Wafer processing method Yoshiteru Nishida, Susumu Yokoo, Hiroyuki Takahashi, Kenta Chito 2020-09-29