Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879152 | Through mold via (TMV) using stacked modular mold rings | Bilal Khalaf | 2020-12-29 |
| 10597698 | Chromatin immunocapture devices and methods of use | Ryan C. Bailey, Joshua David Tice, Tamas Ordog, Jeong Heon Lee, Richard Martin Graybill +1 more | 2020-03-24 |
| 10573575 | Semiconductor package with thermal fins | Hyoung Il Kim, Florence R. Pon, Yuhong Cai, Min-Tih Lai, Leo Craft | 2020-02-25 |