Issued Patents 2020
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10834848 | Cold plate device for a two-phase cooling system | Pritish R. Parida, Fanghao Yang | 2020-11-10 |
| 10823512 | Cold plate with radial expanding channels for two-phase cooling | Pritish R. Parida, Fanghao Yang | 2020-11-03 |
| 10727159 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida +3 more | 2020-07-28 |
| 10727158 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida +3 more | 2020-07-28 |
| 10716239 | Energy efficient data center liquid cooling with geothermal enhancement | Pritish R. Parida | 2020-07-14 |
| 10716245 | Provisioning cooling elements for chillerless data centers | Pritish R. Parida | 2020-07-14 |
| 10701839 | Server cooling system without the use of vapor compression refrigeration | Pritish R. Parida | 2020-06-30 |
| 10701832 | Two-phase liquid cooled electronics | Pritish R. Parida, Mark D. Schultz | 2020-06-30 |
| 10653044 | Energy efficiency based control for a cooling system | Pritish R. Parida, Mark D. Schultz | 2020-05-12 |
| 10653035 | Cold plate device for a two-phase cooling system | Pritish R. Parida, Fanghao Yang | 2020-05-12 |
| 10641558 | Multi-layered counterflow expanding microchannel cooling architecture and system thereof | Pritish R. Parida, Fanghao Yang | 2020-05-05 |
| 10613603 | Inducing heterogeneous microprocessor behavior using non-uniform cooling | Pradip Bose, Alper Buyuktosunoglu, Pritish R. Parida, Augusto J. Vega | 2020-04-07 |
| 10607963 | Chip package for two-phase cooling and assembly process thereof | Thomas J. Brunschwiler, Evan G. Colgan, Michael A. Gaynes, Jeffrey D. Gelorme, Gerard McVicker +4 more | 2020-03-31 |
| 10585462 | System level model for pumped two-phase cooling systems | Leitao Chen, Pritish R. Parida, Mark D. Schultz, Fanghao Yang | 2020-03-10 |
| 10572356 | Storing data in multi-region storage devices | Bulent Abali, Mohammad Banikazemi, James L. Hafner, Dan E. Poff, Krishankumar Rao Surugucchi | 2020-02-25 |
| 10563937 | Cooling systems for cooling electronic components | Pritish R. Parida | 2020-02-18 |
| 10558249 | Sensor-based non-uniform cooling | Pradip Bose, Alper Buyuktosunoglu, Pritish R. Parida, Augusto J. Vega | 2020-02-11 |
| 10559518 | Distribution and stabilization of fluid flow for interlayer chip cooling | Pritish R. Parida, Fanghao Yang | 2020-02-11 |
| 10548241 | Two-phase cooling with ambient cooled condensor | Milnes P. David, Pritish R. Parida | 2020-01-28 |
| 10548228 | Thermal interface adhesion for transfer molded electronic components | Michael A. Gaynes | 2020-01-28 |
| 10529648 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida +3 more | 2020-01-07 |
| 10528096 | Optimizing cooling energy | Pritish R. Parida | 2020-01-07 |