Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672649 | Advanced BEOL interconnect architecture | Chih-Chao Yang | 2020-06-02 |
| 10672653 | Metallic interconnect structures with wrap around capping layers | Cornelius Brown Peethala, Kedari Matam, Chih-Chao Yang | 2020-06-02 |
| 10534888 | Hybrid back end of line metallization to balance performance and reliability | Baozhen Li, Chih-Chao Yang | 2020-01-14 |