Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607919 | Semiconductor package having junction cooling pipes embedded in substrates | Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more | 2020-03-31 |
| 10586754 | Semiconductor die package and manufacturing method | Mankyo Jong, Joonseo SON | 2020-03-10 |