Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658342 | Vertically stacked multichip modules | Changyoung Park | 2020-05-19 |
| 10586754 | Semiconductor die package and manufacturing method | Seungwon IM, Joonseo SON | 2020-03-10 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658342 | Vertically stacked multichip modules | Changyoung Park | 2020-05-19 |
| 10586754 | Semiconductor die package and manufacturing method | Seungwon IM, Joonseo SON | 2020-03-10 |