Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763150 | System for coupling a voltage to spatially segmented portions of the wafer with variable voltage | Philip Allan Kraus, Thai Cheng Chua | 2020-09-01 |
| 10688750 | Bonding structure of E chuck to aluminum base configuration | Vijay D. Parkhe | 2020-06-23 |