Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861708 | Three or more states for achieving high aspect ratio dielectric etch | Takumi Yanagawa, Ranadeep Bhowmick, Eric A. Hudson, Felix Kozakevich, John Holland +2 more | 2020-12-08 |
| 10847377 | Method of achieving high selectivity for high aspect ratio dielectric etch | Takumi Yanagawa | 2020-11-24 |
| 10741407 | Reduction of sidewall notching for high aspect ratio 3D NAND etch | Takumi Yanagawa, Anqi Song | 2020-08-11 |