Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629469 | Solder resist layers for coreless packages and methods of fabrication | Tao Wu, Mihir K. Roy, Wei-Lun Kane Jen, Yi Li | 2020-04-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629469 | Solder resist layers for coreless packages and methods of fabrication | Tao Wu, Mihir K. Roy, Wei-Lun Kane Jen, Yi Li | 2020-04-21 |