KT

Kenji Terada

IBM: 3 patents #2,187 of 11,274Top 20%
KS Kyocera Circuit Solutions: 2 patents #1 of 6Top 20%
Overall (2020): #81,685 of 565,922Top 15%
3
Patents 2020

Issued Patents 2020

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10813215 Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance Jean Audet, Edmund Blackshear, Masahiro Fukui, Charles L. Reynolds, Tomoyuki Yamada 2020-10-20
10806030 Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance Jean Audet, Edmund Blackshear, Masahiro Fukui, Charles L. Reynolds, Tomoyuki Yamada 2020-10-13
10687420 Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance Jean Audet, Edmund Blackshear, Masahiro Fukui, Charles L. Reynolds, Tomoyuki Yamada 2020-06-16