Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607927 | Spot-solderable leads for semiconductor device packages | Manu J. Prakuzhy, Siva Prakash Gurrum, Daryl R. Heussner, Stefan Wlodzimierz Wiktor | 2020-03-31 |
| 10573582 | Semiconductor systems having dual leadframes | Rajeev Joshi, Hau Nguyen, Anindya Poddar | 2020-02-25 |