Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10622290 | Packaged multichip module with conductive connectors | Manu J. Prakuzhy, Saumya Gandhi | 2020-04-14 |
| 10607927 | Spot-solderable leads for semiconductor device packages | Manu J. Prakuzhy, Daryl R. Heussner, Stefan Wlodzimierz Wiktor, Ken Pham | 2020-03-31 |