Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10622294 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Thomas J. Brunschwiler, Bruno Michel | 2020-04-14 |
| 10586760 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Thomas J. Brunschwiler, Bruno Michel | 2020-03-10 |