Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777496 | Chip packages with sintered interconnects formed out of pads | Thomas J. Brunschwiler, Luca Del Carro | 2020-09-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777496 | Chip packages with sintered interconnects formed out of pads | Thomas J. Brunschwiler, Luca Del Carro | 2020-09-15 |