Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679952 | Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh | 2020-06-09 |
| 10672699 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee, Se Woong Cha +4 more | 2020-06-02 |
| 10535620 | Semiconductor package and manufacturing method thereof | No Sun Park | 2020-01-14 |