Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847367 | Methods of forming tungsten structures | David Ross Economy, Brian Beatty, Yongjun Jeff Hu, Jordan D. Greenlee | 2020-11-24 |
| 10840255 | Methods of filling openings with conductive material, and assemblies having vertically-stacked conductive structures | Jordan D. Greenlee, Everett A. McTeer | 2020-11-17 |
| 10777651 | Gate stacks | Yushi Hu, Eric Blomiley, Everett A. McTeer, Matthew J. King | 2020-09-15 |
| 10731273 | Source material for electronic device applications | Yushi Hu, Yongjun Jeff Hu, Everett A. McTeer | 2020-08-04 |
| 10727250 | Methods used in forming an array of elevationally-extending transistors | Jordan D. Greenlee, E. Allen McTeer | 2020-07-28 |
| 10700091 | Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars | David Ross Economy, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley +1 more | 2020-06-30 |
| 10651381 | Apparatuses including electrodes having a conductive barrier material and methods of forming same | Swapnil Lengade, Andrea Gotti | 2020-05-12 |
| 10573661 | Methods of filling horizontally-extending openings of integrated assemblies | Jordan D. Greenlee, Chet E. Carter, Collin Howder, Everett A. McTeer | 2020-02-25 |
| 10559579 | Assemblies having vertically-stacked conductive structures | Jordan D. Greenlee, Everett A. McTeer | 2020-02-11 |
| 10553611 | Memory arrays and methods of fabricating integrated structure | Yushi Hu, Rita J. Klein, John D. Hopkins, Hongbin Zhu, Gordon A. Haller +1 more | 2020-02-04 |
| 10546848 | Integrated assemblies and methods of forming integrated assemblies | Daniel Billingsley, Everett A. McTeer, Christopher W. Petz, Haoyu Li, Yongjun Jeff Hu | 2020-01-28 |