Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847469 | CTE compensation for wafer-level and chip-scale packages and assemblies | Kenneth Vanhille, Aaron C. Caba, Masud Beroz, Timothy Amis Smith, Anatoliy O. Boryssenko +1 more | 2020-11-24 |