Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867899 | Semiconductor packages | Yuan-Fu Sung, Shin-Hua Chao, Ming-Chi Liu | 2020-12-15 |
| 10685883 | Method of wafer dicing and die | Cheng-Hong Wei, Ching-Wei Chen, Shuo-Che Chang | 2020-06-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867899 | Semiconductor packages | Yuan-Fu Sung, Shin-Hua Chao, Ming-Chi Liu | 2020-12-15 |
| 10685883 | Method of wafer dicing and die | Cheng-Hong Wei, Ching-Wei Chen, Shuo-Che Chang | 2020-06-16 |