Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685883 | Method of wafer dicing and die | Cheng-Hong Wei, Hung-Sheng Chen, Shuo-Che Chang | 2020-06-16 |
| 10558674 | Methods and apparatus for determining a mood profile associated with media data | Kyogu Lee, Peter C. DiMaria, Markus K. Cremer | 2020-02-11 |