Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685883 | Method of wafer dicing and die | Cheng-Hong Wei, Hung-Sheng Chen, Ching-Wei Chen | 2020-06-16 |
| 10636967 | Method for manufacturing electrode and resistive random access memory | Yi-Chung Chen, Cheng-An Peng, Sung-Ying Wen | 2020-04-28 |