Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796978 | TIM strain mitigation in electronic modules | Sri M. Sri-Jayantha | 2020-10-06 |
| 10607963 | Chip package for two-phase cooling and assembly process thereof | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Michael A. Gaynes, Jeffrey D. Gelorme +4 more | 2020-03-31 |