Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679937 | Devices and methods of forming low resistivity noble metal interconnect | Xunyuan Zhang, Frank W. Mont | 2020-06-09 |
| 10636698 | Skip via structures | Xunyuan Zhang, Frank W. Mont | 2020-04-28 |
| 10580696 | Interconnects formed by a metal displacement reaction | Sean Xuan Lin, Christian Witt, Mark V. Raymond, Nicholas V. LiCausi | 2020-03-03 |