Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763185 | Packaged semiconductor components having substantially rigid support members | Matt E. Schwab, J. Michael Brooks | 2020-09-01 |
| 10692827 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Matt E. Schwab, J. Michael Brooks | 2020-06-23 |
| 10593607 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, Choon Kuan Lee, Chin Hui Chong | 2020-03-17 |