Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10593607 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, David J. Corisis, Chin Hui Chong | 2020-03-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10593607 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, David J. Corisis, Chin Hui Chong | 2020-03-17 |