Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861824 | Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices | Seng Kim Ye | 2020-12-08 |
| 10593607 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, Choon Kuan Lee, David J. Corisis | 2020-03-17 |