Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879195 | Method for substrate moisture NCF voiding elimination | Brandon P. Wirz, Jeremy E. Minnich | 2020-12-29 |
| 10840209 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Mark E. Tuttle | 2020-11-17 |
| 10840210 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Mark E. Tuttle | 2020-11-17 |
| 10700038 | Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool | Jeremy E. Minnich | 2020-06-30 |
| 10548230 | Method for stress reduction in semiconductor package via carrier | Xiao Li | 2020-01-28 |