Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692801 | Bond pad and clip configuration for packaged semiconductor device | Eung San Cho, Jobelito Anjao Guanzon | 2020-06-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692801 | Bond pad and clip configuration for packaged semiconductor device | Eung San Cho, Jobelito Anjao Guanzon | 2020-06-23 |