JG

Jobelito Anjao Guanzon

IA Infineon Technologies Austria Ag: 1 patents #86 of 233Top 40%
📍 Cuenca, PH: #1 of 5 inventorsTop 20%
Overall (2020): #413,420 of 565,922Top 75%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10692801 Bond pad and clip configuration for packaged semiconductor device Eung San Cho, Chuan Cheah 2020-06-23