Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734393 | Methods of forming package structures for enhanced memory capacity and structures formed thereby | Navneet Singh, Shanto A. Thomas | 2020-08-04 |
| 10720407 | Microelectronic interposer for a microelectronic package | Navneet Singh | 2020-07-21 |
| 10608311 | Cable assembly comprising a single wire coupled to a signal launcher and housed in a first cover portion and in a second ferrite cover portion | Arvind Sundaram, Ramaswamy Parthasarathy, Vikas Mishra | 2020-03-31 |