Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734393 | Methods of forming package structures for enhanced memory capacity and structures formed thereby | Shanto A. Thomas, Ranjul Balakrishnan | 2020-08-04 |
| 10720407 | Microelectronic interposer for a microelectronic package | Ranjul Balakrishnan | 2020-07-21 |
| 10656177 | Probe connector for a probing pad structure around a thermal attach mounting hole | Vikas Rao, Naveen G | 2020-05-19 |