Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10606774 | High performance interconnect physical layer | Venkatraman Iyer, Darren S. Jue, Robert G. Blankenship | 2020-03-31 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10606774 | High performance interconnect physical layer | Venkatraman Iyer, Darren S. Jue, Robert G. Blankenship | 2020-03-31 |