Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868172 | Vertical power devices with oxygen inserted Si-layers | Oliver Blank, Thomas Feil, Maximilian Roesch, Robert Haase, Sylvain Leomant +2 more | 2020-12-15 |
| 10861966 | Vertical trench power devices with oxygen inserted Si-layers | Thomas Feil, Robert Haase, Maximilian Roesch, Sylvain Leomant, Bernhard Goller +1 more | 2020-12-08 |
| 10790353 | Semiconductor device with superjunction and oxygen inserted Si-layers | Robert Haase, Sylvain Leomant, Maximilian Roesch, Ravi Keshav Joshi, Andreas Meiser +2 more | 2020-09-29 |
| 10741638 | Oxygen inserted Si-layers for reduced substrate dopant outdiffusion in power devices | Robert Haase, Maximilian Roesch, Sylvain Leomant, Andreas Meiser, Bernhard Goller +1 more | 2020-08-11 |
| 10672664 | Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor device | Paul Ganitzer, Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller +1 more | 2020-06-02 |
| 10593623 | Semiconductor device with metallization structure on opposite sides of a semiconductor portion | Paul Ganitzer | 2020-03-17 |
| 10580888 | Oxygen inserted Si-layers for reduced contact implant outdiffusion in vertical power devices | Oliver Blank, Thomas Feil, Maximilian Roesch, Robert Haase, Sylvain Leomant +2 more | 2020-03-03 |
| 10573742 | Oxygen inserted Si-layers in vertical trench power devices | Thomas Feil, Robert Haase, Maximilian Roesch, Sylvain Leomant, Bernhard Goller +1 more | 2020-02-25 |