Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607911 | Chip carrier laminate with high frequency dielectric and thermomechanical buffer | Walter Hartner, Gerhard Haubner, Sebastian Pahlke | 2020-03-31 |
MN
Martin Richard Niessner
Overall (2020): #358,774 of 565,922Top 65%
1
Patents 2020