Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607911 | Chip carrier laminate with high frequency dielectric and thermomechanical buffer | Martin Richard Niessner, Walter Hartner, Sebastian Pahlke | 2020-03-31 |
GH
Gerhard Haubner
Overall (2020): #466,401 of 565,922Top 85%
1
Patents 2020