Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797016 | Method for bonding semiconductor chips to a landing wafer | Eric Beyne, Giovanni Capuz | 2020-10-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797016 | Method for bonding semiconductor chips to a landing wafer | Eric Beyne, Giovanni Capuz | 2020-10-06 |