Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797016 | Method for bonding semiconductor chips to a landing wafer | Vikas Dubey, Giovanni Capuz | 2020-10-06 |
| 10636739 | Integrated circuit chip with power delivery network on the backside of the chip | Julien Ryckaert | 2020-04-28 |