Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10699972 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | William E. Bernier, Timothy H. Daubenspeck, Virendra R. Jadhav, David L. Questad | 2020-06-30 |
| 10580738 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2020-03-03 |