Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796921 | CMP fluid and method for polishing palladium | Ryouta Saisyo, Jin Amanokura, Yuuhei Okada, Hiroshi Ono | 2020-10-06 |
| 10759968 | Abrasive, abrasive set, and method for polishing substrate | Tomohiro Iwano, Toshiaki Akutsu | 2020-09-01 |
| 10752807 | Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrate | Tomohiro Iwano, Keita ARAKAWA, Takahiro Hidaka | 2020-08-25 |
| 10557058 | Polishing agent, polishing agent set, and substrate polishing method | Toshiaki Akutsu, Tomohiro Iwano, Koji Fujisaki | 2020-02-11 |
| 10557059 | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | Tomohiro Iwano, Toshiaki Akutsu, Koji Fujisaki | 2020-02-11 |
| 10549399 | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | Tomohiro Iwano, Toshiaki Akutsu, Koji Fujisaki | 2020-02-04 |