Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796973 | Test structures connected with the lowest metallization levels in an interconnect structure | Vara Govindeswara Reddy Vakada, Edward P. Maciejewski, Brian J. Greene, Atsushi Ogino, Vikrant Chauhan +1 more | 2020-10-06 |
| 10790204 | Test structure leveraging the lowest metallization level of an interconnect structure | Vara Govindeswara Reddy Vakada, Edward P. Maciejewski, Brian J. Greene, Atsushi Ogino, Vikrant Chauhan +1 more | 2020-09-29 |