Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796973 | Test structures connected with the lowest metallization levels in an interconnect structure | Mankyu Yang, Vara Govindeswara Reddy Vakada, Edward P. Maciejewski, Brian J. Greene, Atsushi Ogino +1 more | 2020-10-06 |
| 10790204 | Test structure leveraging the lowest metallization level of an interconnect structure | Mankyu Yang, Vara Govindeswara Reddy Vakada, Edward P. Maciejewski, Brian J. Greene, Atsushi Ogino +1 more | 2020-09-29 |
| 10579774 | Integrated circuit (IC) design systems and methods using single-pin imaginary devices | Heng Lan Lau, Manjunatha Prabhu, Shawn Walsh | 2020-03-03 |