Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10750612 | Flexible circuit board having enhanced bending durability and method for preparing same | Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung | 2020-08-18 |
| 10681803 | Flexible circuit board with improved bonding flatness | Byung Hoon Jo, Byung Yeol Kim, Hee Seok Jung | 2020-06-09 |
| D886073 | Flexible printed circuit board | Ik Soo Kim, Byung Yeol Kim, Byung Hoon Jo, Hee Seok Jung | 2020-06-02 |
| 10624209 | Flexible printed circuit board | Ik Soo Kim, Byung Yeol Kim, Byung Hoon Jo, Da Yeon Lee, Hwang Sub Koo +2 more | 2020-04-14 |
| 10561015 | Flexible circuit board having enhanced bending durability and method for preparing same | Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung | 2020-02-11 |