Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10681803 | Flexible circuit board with improved bonding flatness | Sang Pil Kim, Byung Yeol Kim, Hee Seok Jung | 2020-06-09 |
| D886073 | Flexible printed circuit board | Sang Pil Kim, Ik Soo Kim, Byung Yeol Kim, Hee Seok Jung | 2020-06-02 |
| 10624209 | Flexible printed circuit board | Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo +2 more | 2020-04-14 |