Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10829669 | Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device | Takumi Asanuma, Yasushi Ishizaka | 2020-11-10 |
| 10829670 | Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device | — | 2020-11-10 |
| 10556974 | Curable and hygroscopic resin composition for sealing electronic devices, sealing resin, and electronic device | Takumi Asanuma, Yasushi Ishizaka | 2020-02-11 |