Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10829669 | Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device | Tetsuya Mieda, Yasushi Ishizaka | 2020-11-10 |
| 10556974 | Curable and hygroscopic resin composition for sealing electronic devices, sealing resin, and electronic device | Tetsuya Mieda, Yasushi Ishizaka | 2020-02-11 |