Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863629 | Method of manufacturing through hole of substrate | Kiyoyuki Hatanaka, Shigeru Sugino, Takahiro Kitagawa, Ryo Kanai, Mitsunori Abe | 2020-12-08 |
| 10624216 | Wiring board, electronic apparatus, method for attaching sheet metal covers, and method for manufacturing wiring board | Takahiro Kitagawa, Mitsunori Abe, Shigeru Sugino, Kiyoyuki Hatanaka, Shigeo Iriguchi +1 more | 2020-04-14 |
| 10605851 | Printed wiring board, crack prediction device, and crack prediction method | Shigeo Iriguchi, Naoki Nakamura, Shigeru Sugino, Takahide Mukoyama, Ryo Kanai +1 more | 2020-03-31 |